Send an inquiry Order newsletter DDR Signal Integrity Simulations Bus performance is at the essence of maximizing PCU and memory performance Memory buses on current electronics boards have become extremely fast requiring understanding on high speed signal behavior on printed circuit boards (PCB). Today capabilities of computers allow for desk top simulations of signal integrity on dense product PCBs. Often simulations find PCB issues on memory buses before the first protype is ordered. With signal integrity simulations on your PCB you ensure that your product is maximizing CPU and memory performance.
Key benefits Knowledge of the DDR3/4 bus performance before ordering the prototype Less prototype rounds results in faster time to market Potentially lower total R&D cost Minimized cross talk on the board Lower power consumption due to lower bus current drive needed Get Your Signal Integrity Simulations from Etteplan Having poor performance on your PCB is like having bad speaker cables on your HiFi system. The sound performance or in this case the memory performance just isn’t the same. Etteplan has the expertise and understanding on high speed signal behavior on PCBs and the capabilities to perform signal integrity simulations on your product. With our signal integrity simulations you can guarantee the performance of your PCB. Ask for more information. Simulation Phases The memory simulation has multiple phases: design input, design simulation with ideal transmission lines, small signal simulation of PCB, large signal simulation with PCB and component models and eventually virtual compliance simulation. High frequency simulation of PCB and components match the real performance very well if nonidealities are present. How we work? Step 1: Kick-off In the kick-off meeting we will discuss your simulation needs. The product and its structure is analyzed, and the contents of the simulation are discussed and agreed. Step 2: Simulation phase The simulation phase starts by transferring your PCB as well as the components and necessary simulation models to the simulation environment. Next, the simulation set up is performed including PCB stack-up. And lastly, your product is simulated in agreed simulation phases. Step 3: Report and review of the results After the simulations, we will create a report on your product design consisting of simulation setup, results and conclusions. Next, we will deliver the report to you and discuss the findings. Finally, we will make improvement recommendations on your design if necessary.
Inquire about our prices and sales packages Pre-PCB order CPU-DDR3/4 design simulation with ideal transmission lines and IBIS models CPU-DDR3/4 small signal simulation with designed PCB for line impedances and signal integrity CPU-DDR3/4 non-linear transient simulation with designed PCB and IBIS models JEDEC virtual compliance simulation option Post-PCB CPU-DDR3/4 small signal simulation with designed PCB for line impedances and signal integrity CPU-DDR3/4 non-linear transient simulation with designed PCB and IBIS models JEDEC virtual compliance simulation option
